|
Standard and Specifications
|
IPC
|
Joint Industry Standard Solderability Tests for Printed Boards
|
J-STD-003
|
|
IPC Printed Circuits Expo
(26-30 April 1998) |
IPC
|
Conference Proceedings
|
CP10-01
|
|
Microvia and High Density Interconnect Material Selection, Fabrication Processes, and Design Guidelines (27 April 1998)
|
IPC
|
W-22
|
CP7-01
|
|
A Summit on PWB Surface Finishes and Solderability
(24-25 September 1998) |
IPC
|
– Volume one
– Volume two |
CP15-01
CP15-02 |
|
IPC Asia PCB Conference 1998?(7 October 1998)
|
IPC / Singapore Surface Finishing Society
|
Conference Proceedings
|
CP25-01
|
|
IPC 3rd Annual National Conference on High Density Interconnect Structures (HDIS)
(19-20 November 1998) |
IPC
|
– Volume one
– Volume two |
CP17-01
CP17-02 |
|
IPC Printed Circuits Expo
(14-18 March 1999) |
IPC
|
Conference Proceedings
|
CP23-01
|
|
Electronics Packaging Manufacturing
|
IEEE
|
April 1999 Vol.22 No.2
|
CP6-01
|
|
Advanced Packaging
|
IEEE
|
May 1999 Vol.22 No.2
|
CP6-02
|
|
IPC Chip Scale and BGA National Symposium Proceedings
(6-7 May 1999) |
IPC
|
– Volume One
– Volume Two – Singulation of CSP and TBGATM? |
CP4-01
CP4-02 CP4-03 |
|
IPC/CCA National Conference on Bare Board and Advanced Substrate Electrical Test: HDI Holy Grail
(20-21 May 1999) |
IPC/CCA
|
– Volume One
– Volume Two |
CP5-01CP5-02
|
|
Components and Packaging Technologies
|
IEEE
|
June 1999 Vol.22 No.2
|
CP6-03
|
|
IPC 5th Annual National Conference & Workshops on Flexible Circuits
(8-10 June 1999) |
IPC
|
– Volume 1
– Volume 2 |
CP1-01
CP1-02 |
|
IPC 5th Annual National Conference on Flexible Circuits
(9-10 June 1999) |
IPC
|
– Volume 1
– Volume 2 – Supplement |
CP31-01
CP31-02CP31-03 |
|
Electronic Circuits World Convention 8?
(7-10 September 1999) |
Japan Printed Circuit Association (JPCA) /
European Institute of Printed Circuits (EIPC) /IPC, Association Connecting Electronics Industries /UK Electronic Circuits World Convention 8 Committee (UKECWC8) |
– ECWC8 Asian Supporters’Session Program
– HDI Track: H1?Build-up Technologies – HDI Track: H2 Microvia Technologies – HDI Track: H3 Technology?Options – HDI Track: H4 Interconnection Approaches / Interposer Characteristic |
CP2-01
CP2-02 CP2-03 CP2-04 CP2-05 |
|
– Process Track: P1 Imaging Innovations
– Process Track: P2 DielectricMaterials – Process Track: P3 Copper Metalization – Process Track: P4 Surface Finishes/ Plating Improvements |
CP2-10
CP2-11 CP2-12 CP2-13 |
||
|
– Technical Track: T1 Impedance Control Design
– Technical Track: T2 Testing Technologies / Soldering & Assembly – Technical Track: T3 “Green” Technologies – Technical Track: T4 Innovations |
CP2-14
CP2-15 CP2-16 CP2-17 |
||
|
– Poster Presentations: PO1 Board Fabrication Process for Poster
– Poster Presentations: PO2 Design & Reliability Analysis for Poster – Poster Presentations: PO3 Manufacturing Challenges for Poster – Poster Presentations: PO4 Material Innovation for Poster – Poster Presentations: PO5 High Density Interconnections for Poster – Poster Presentations: PO6 Management & Environment for Poster |
CP2-18
CP2-19 CP2-20 CP2-21 CP2-22 CP2-23 |
||
|
Controlled Impedance for PCB
(15 November 1999) |
Hong Kong Productivity Council
|
Live Demonstration
|
CP3-01
|
|
4th Annual National Conference on High Density Interconnect Structures (HDIS)
(18-19 November 1999) |
IPC
|
– Volume one
– Volume two – Improved Plating Distribution in High Aspect Ratio Microvias (by Dennis Fritz, MacDermid, Inc.) |
CP19-01
CP19-02 CP19-03 |
|
IPC 3rd Annual National Conference:
A Summit on Surface Finishes an PWB Solderability (23-24 September 1999) |
IPC
|
– Volume one
– Volume two |
CP18-01 |
|
IPC Printed Circuits Expo
(4-6 April 2000) |
IPC
|
Conference Proceedings
|
CP11-01
|
|
IPCWorks 2000 |
IPC
|
Conference Proceedings
|
CP14-01
|
|
IPC 5th Annual National Conference on High Density Interconnect Structures(HDIS)(9-10 November 2000)
|
IPC
|
Conference Proceedings
|
CP9-01
|
|
TPCA 2000 Forum Market Trends
(23-25 November 2000) |
TPCA Show 2000
|
—-
|
CP8-01
|
|
TPCA 2000 Forum Proceedings
(23-25 November 2000) |
TPCA Show 2000
|
—-
|
CP8-02
|
|
IPC Printed Circuits Expo
(1-5 April 2001) |
IPC
|
Conference Proceedings
|
CP12-01 |
|
IPC International Conference on Opto-Electronics:
Let There be Ligth! An Exploration of Photonics in Electronics Manufacturing (3-4 May 2001) |
IPC
|
Conference Proceedings
|
CP16-01
|
|
Apex 2002
(19-24 January 2002) |
IPC
|
Conference Proceedings
Technical Paper: Fundamentals and Challenges in Optoelectronics Assembly |
CP24-01
CP24-02 |
|
Technical Proceedings for the Designers Learning Symposium-TEXAS
(20-25 March 2002) |
IPC
|
Conference Proceedings
|
CP21-01 |
|
IPC Printed Circuits Expo
(24-28 March 2002) |
IPC
|
Conference Proceedings
|
CP13-01 |
|
International Conference on Lead-Free Electronic Components and Assemblies
(1-2 May 2002) |
IPC
|
– Conference Proceedings Addendum
– Conference Proceedings |
CP20-01
CP20-02 |
|
IPC 2nd International Conference on Optoelectronics: At the Speed of Light Proceedings
An Exploration of Photonics in Electronics Manufacturing (12-13 June 2002) |
IPC |
Conference Proceedings
|
CP22-01 |
|
2002 South China PCB Conference
(10-13 September 2002) |
Hong Kong Printed Circuit Association
|
Conference Proceedings
|
CP26-01 |
|
SMTA International 2002
(22-26 September 2002) |
Surface Mount Technology Association
|
Conference Proceedings (with CD-ROM)
|
CP27-01
|
|
Technology for Lead Free Solder Alloy and Application
(1 March 2003) |
Hong Kong Productivity Council |
Conference Proceedings
|
CP28-01
|
|
IPC’s First International Conference on Embedded Passive “The Faster and Cleaner Electronic Signals for the Future”
(10-11 June 2003) |
IPC
|
Conference Proceedings
|
CP29-01
|
|
International Micro-Fabrication Technology Symposium |
Hong Kong Productivity Council |
Conference Proceedings
|
CP30-01
|
